High Density Interconnect PCB Market Research Report- Forecast till 2023
Market Highlights
Market Research Future (MRFR), in its latest report on the Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market 2020, states major factors that are expected to boost the expansion of the market across the study period. An in-depth analysis of the impact of coronavirus outbreak on the high density interconnect PCB market is provided along with the report. As per MRFR analysis, the worldwide market of High Density Interconnect PCB is expected to rise at 12.4% CAGR across the analysis period 2018–2013. High Density Interconnect PCB value can touch USD 15,600.6 Mn from USD 8,683.9 Mn in 2018 to 2023.
The growing awareness about the higher circuitry density of HDI PCB over traditional PCB that allows designers to fit more components on an HDI PCB is expected to underpin the expansion of the market in the years to come. Features, such as shorter distance between electronic components and their compactness aid in the reduction of signal loss and crossing delays that result in the rapid transmission of signals. This is observed to improve the desirability of HDI PCB among its end-users and is likely to boost the expansion of the market in the study period.
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Segmentation:
The segment study of the global HDI PCB Market is done by number of high-density interconnection layer and industry vertical.
The number of high density interconnection layer based segments of the HDI PCB Market are 1, 2, and all. The industry vertical based segments of the High Density Interconnect PCB Market are military and defense, consumer electronics, automotive, telecom and IT, medical devices, manufacturing, and others. The rise in the application of HDI PCB in the automobile sector can drive the expansion of the market. A wide range of application of consumer electronics and increase in the usage of HDI PCB driven consumer electronics can spur the expansion of the HDI PCB market in the years to come. The penetration of HDI PCB in the manufacturing sector can boost the expansion of the high density interconnect PCB market.
Regional Analysis
In North America, the rise in the need for smaller and energy-efficient PCBs is identified as the major driver for the expansion of the HDI PCB market. The growing requirement for smarter, faster, lighter, and smaller electronic products among the tech-savvy population of the region, especially in the US, is likely to boost the expansion of North America market across the evaluation period. The growing cellular mobile phone market and constant rise in innovations are expected to promote the expansion of the HDI PCB market across the analysis period. In Europe, the high rate of application of simple monochromic display, along with the growing utility of basic voice call capability with features, such as; rich computing solutions, high-resolution touch screen, fast internet connectivity, camera, and GPS, music player among others can promote the expansion of the High Density Interconnect PCB Market in Europe. In APAC, the high rate of utility of smaller laptops facilitated by HDI PCBs and the introduction of related technical developments and manufacturing breakthrough can support the expansion of Asia Pacific High Density Interconnect PCB Market in the years ahead.
Key players
FINELINE Ltd. (Israel), SIERRA CIRCUITS, INC. (US), Advanced Circuits (US), TTM Technologies (US), Epec, LLC (US), PCBCART (China), RAYMING (China), Millennium Circuits Limited (US), Mistral Solutions Pvt. Ltd. (India), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), and Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) are some reputed companies functioning in the HDI PCB Market, sorted by MRFR.
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High Density Interconnect PCB Market: By Form Factor (Rack & tower servers, Blade servers), Business Type (Data centers and Enterprise customers), and Processor (X 86 servers, Non-X86 servers), Operating System (Linux and Others) – Global Forecast till 2023
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This release was published on openPR.
