Advanced Packaging Market 2020: Comprehensive Study Explores Huge Growth of 2025 with Top Key Players – ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Huatian, NFM, Walton

Advanced Packaging Market

Advanced Packaging Market

Overview of Global Advanced Packaging Market:

This report provides in-depth study of “Global Advanced Packaging Market 2020” using SWOT analysis i.e. Strength, Weakness, Opportunities, and Threat to the organization. The Advanced Packaging Market report also provides an in-depth survey of key players in the market organization.

The Global Advanced Packaging Market has also suffered a certain impact, but still maintained a relatively optimistic growth, the past four years, Advanced Packaging market size to maintain the average annual growth rate of 11.22% from USD 7400 Million in 2015 to USD 10180 Million in 2019, market analysts believe that in the next few years, Advanced Packaging market size will be further expanded, we expect that by 2025, The market size of the Advanced Packaging will reach USD 14880 Million.

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Major key factors driving the growth of the Global Advanced Packaging Market are innovation in packaging technology and increasing necessity for high performing chips in various consumer electronics devices. In addition, humungous demand for 3D Integrated Circuit and 2.5D packaging in chips that are utilized in smartphones will foster the demand for the advanced packaging during the ensuing years. Furthermore, large-scale acceptance of next-gen semiconductor tool is predicted to scale up the use of myriad advanced packaging methods, thereby steering the industry trends.

Geographically, APAC is expected to grow at a significant rate. It has been a major revenue-generating region during the forecast period, primarily due to the growing population and the customer-side demand. Major semiconductor manufacturing companies present were present from a significant amount of time in the region are fueling the need for advanced packaging. Further, China is one of the largest growing economies present with a large population, and according to statistics from China’s semiconductor association; the import of IC was witnessing an increase in the demand for the consecutive years from 2014.

In the end, the report makes some important proposals for a new project of Advanced Packaging Market before evaluating its feasibility. Overall, the report provides an in-depth insight of 2013-2025 global Advanced Packaging market covering all important parameters.

Global Key Vendors:


2 Amkor


4 Stats Chippac



7 J-Devices


9 Chipmos

10 Chipbond

11 Carsem

12 Walton

13 Formosa

14 NEPES and More………………..

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Product Type Segmentation

1 3.0 DIC



4 3D WLP

5 WLCSP/2.5D/Filp Chip

Industry Segmentation

1 Automotives

2 Computers

3 Communications


5 Healthcare

Top Technology Industry News:

Amkor (July 22, 2019) – Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna in Package Technology – Amkor Technology, Inc., a leading provider of outsourced semiconductor assembly and test (OSAT) services, is paving the way for 5G mmWave antenna-in-package (AiP) technology. Amkor’s cutting-edge AiP technology has already been deployed into modules designed for smartphones and other mobile devices. Starting in July 2018, Amkor was the first OSAT to market with 5G mmWave AiP technology, expanding on years of advanced System in Package (SiP) experience.

“Amkor has deployed our AiP technology into 5G product applications with a major global communications company, working with them to produce their first AiP product to go to market,” said Ron Huemoeller, Corporate VP of R&D for Amkor Technology. “A key focus for us is to continue to develop AiP products with revolutionary packaging concepts that are vital to the implementation of highly integrated circuitry,” he added.

The total RF front-end module SiP market is projected to reach US $5.3 billion by 2023, representing an 11.3% compound annual growth rate (CAGR) according to Yole Développement, SA, an industry consulting firm.

“5G will bring more packaging business for OSAT providers,” said Santosh Kumar, Yole Korea principal analyst and director, Packaging, Assembly & Substrates. “Typical RF front-end components in smartphones include various switches, filters, amplifiers and the antennas themselves. More and more, SiP technology is needed to implement an increasing number of bands and the development of circuitry in ever-smaller surfaces.”

In addition to its formidable SiP capacity and AiP technology, Amkor has developed an extensive toolset to maximize circuit density and address the sophisticated packaging formats required to productize 5G applications – such as double-sided assembly, embedded die in substrate, advanced RDL molding and various types of RF shielding. This toolset, combined with the company’s expertise in RF and antenna package design, uniquely positions Amkor to serve customers who want to outsource the challenges and high investment associated with combining multiple ICs with advanced package assembly and test technologies for 5G networks.

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Major Points in Table of Contents:

Global Advanced Packaging Market Report 2020

1 Advanced Packaging Product Definition

2 Global Advanced Packaging Market Manufacturer Share and Market Overview

2.1 Global Manufacturer Advanced Packaging Shipments

2.2 Global Manufacturer Advanced Packaging Business Revenue

2.3 Global Advanced Packaging Market Overview

2.4 COVID-19 Impact on Advanced Packaging Industry

3 Manufacturer Advanced Packaging Business Introduction

3.1 ASE Advanced Packaging Business Introduction

3.2 Amkor Advanced Packaging Business Introduction

3.3 SPIL Advanced Packaging Business Introduction

3.4 Stats Chippac Advanced Packaging Business Introduction

3.5 PTI Advanced Packaging Business Introduction

3.6 JCET Advanced Packaging Business Introduction

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